Features
C-300-MCU-M
- Tin-plated copper foil with masking tape.
- Saves you the trouble of applying conductivity treatments (plating or conductive coating) to a casing or housing.
- Following application, simply peel the masking tape away from the tin-plated copper foil surface.
- After masking tape removal, the tin-plated copper foil can be used as a conducting surface.
- Uses electrically conductive adhesive to minimize any shielding effect.
- Easy handling and application.
- Characteristics are the same as for C-300-MCU-T.
Specification
C-300-MCU-M
- One sheet: 10pcs
Specific Uses
C-300-MCU-T
- Tin-plated copper foil with masking tape.
- Saves you the trouble of applying conductivity treatments (plating or conductive coating) to a casing or housing.
- Following application, simply peel the masking tape away from the tin-plated copper foil surface.
- After masking tape removal, the tin-plated copper foil can be used as a conducting surface.
- Uses electrically conductive adhesive to minimize any shielding effect.
- Easy handling and application.
Remarks
- Grounding/shielding for cases/housings
- Masks during painting and prevents casing corrosion.
| Model | ROHS | Remarks | Code | Ask Price | 2D | 3D |
|---|---|---|---|---|---|---|
| C-300-MCU-T10 |
|
24341 | Email Whatsapp | |||
| C-300-MCU-T13 |
|
24342 | Email Whatsapp | |||
| C-300-MCU-T19 |
|
24343 | Email Whatsapp | |||
| C-300-MCU-T25 |
|
24344 | Email Whatsapp | |||
| C-300-MCU-M4 |
|
24345 | Email Whatsapp | |||
| C-300-MCU-M5 |
|
24346 | Email Whatsapp | |||
| C-300-MCU-M6 |
|
30m | 24486 | Email Whatsapp | ||
| C-300-MCU-M8 |
|
30m | 24487 | Email Whatsapp |